Bussing

We contact your CI(G)S, CdTe and a-Si/μ-morph substrate fully automatically. You can choose your favorit contacting methode out of ultrasonic welding, conductive glue or conductive tape.

The substrate is fed into the system and is exactly positioned. In the first cell, a dispenser applies an accurate line of conductive glue to the substrate. This process is optically monitored. After dispensing, the substrate is passed to the second cell and is re-positioned. Then the ribbon is stretched across the entire length of the substrate and is precisely placed on the deposited conductive glue. Finally, a black cover tape is rolled out over the ribbon in a way that ensures that no air is trapped under the cover tape.